Copper pyrophosphate hydrate
Molecular Structure:
MDL:
MFCD00150225
Molecular Formula:
Cu2P2O7·xH2O
Molecular Weight:
301.04(anhydrousbasis)
Alias:
Product order:
Name |
Specifications |
Packing |
Price |
Delivery |
Copper pyrophosphate hydrate |
CP |
500g |
RMB 132 |
Consulting service |
Copper pyrophosphate hydrate |
電鍍級(jí),99% |
500g |
RMB 159.5 |
Consulting service |
Character:
粉藍(lán)色結(jié)晶粉未,溶于酸,難溶于水,有毒,可與焦磷酸鈉形成復(fù)鹽,對(duì)金屬離子具有較強(qiáng)絡(luò)合能力。
Quality Standard: 項(xiàng)目Item 化學(xué)純
(CP)
含量(Cu2P2O7·3H2O)Assay,% ≥ 98.0
氯化物(Cl)Chloride,% ≤ 0.01
鈉(Na)Sodium,% ≤ 0.01
鐵(Fe)Iron,% ≤ 0.002
品級(jí)Grade 電鍍級(jí)
外觀Appearance 淡蘭色粉末
純度Purity ≥99.0%
Fe ≤0.01%
Pb ≤0.005%
SO4 ≤0.60%
Storage:
用作電鍍添加劑、配制磷酸鹽顏料。